Sources at Digitimes, a site known for its hit and miss leaks on Apple devices, claims that Qualcomm is collaborating with TSMC to build modems for this year’s iPhones, using the latter’s 20-nanometer process. The site also claims that Apple may be considering Intel LTE Modem for future iPhone models that will be coming in 2017.

Qualcomm is partnering with TSMC to supply 100% of the modem chips for use in the new iPhones slated for launch in September 2015, the sources said. The chips are built using TSMC’s 20nm process, the sources noted.

The source adds that Qualcomm is working with TSMC to supply Apple 100 percent of the modems it will be requiring for the new iPhones this year. The new modem will be based on the 20nm fabrication process that will make them more power efficient. A previous leak also indicates that the new iPhones will feature faster LTE connectivity.

Regarding Intel modems, the report states that Intel might have won as much as half of the modem orders for next-generation iPhones and Apple has been considering an Intel modem “for a while”.

Intel has been making modem for smartphones since quite some time, but they have not been as advanced as competing products from Qualcomm. Nonetheless, the chip giant has made some huge progress recently in improving the performance and power efficiency of its modems.

DigiTimes has a mixed track record when it comes to Apple hardware, but could have some insight as it’s primarily focused on the supply sector.

Apple is reportedly set to hold an event on September 9 this year to unveil the iPhone 6s and iPhone 6s Plus, which will come with 2GB RAM, Force Touch display, and a 12MP camera. It is also rumored that Apple might also reveal “iPhone 6c,” during the event, which if it exists might sport the specifications of the iPhone 6 in a device the size of the iPhone 5s.

Source: Digitimes